IC packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

The packaging stage is followed by testing of the integrated circuit.

The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards.

The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance. Both the structure and materials must prioritize signal transmission properties, while minimizing any parasitic elements that could negatively affect the signal.

Controlling these characteristics is becoming increasingly important as the rest of technology begins to speed up. Packaging delays have the potential to make up almost half of a high-performance computer's delay, and this bottleneck on speed is expected to increase.

The integrated circuit package is responsible for keeping the chip safe from all sorts of potential damage. The package must resist physical breakage, provide an airtight seal to keep out moisture, and also provide effective heat dissipation away from the chip. At the same time, it must have effective means of connecting to a PCB, which can change drastically depending on the package type. The materials used for the body of the package are typically either plastic (thermoset or thermoplastic) or ceramic. They both can offer a high thermal conductivity and decent mechanical strength. Ceramic generally has more preferable characteristics, but is more expensive.

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