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Zen (microarchitecture)

AMD Zen
AMD ZEN.png
Logo for the Zen microarchitecture
Produced Q1 2017
Designed by AMD
Common manufacturer(s)
Instruction set AMD64 (x86-64)
Cores
  • 4 (essential)
  • 4–6 (mainstream)
  • 8 (enthusiast)
  • 8–32 (server)
L1 cache 64 KiB instruction, 32 KiB data per core
L2 cache 512 KiB per core
L3 cache 8 MiB per quad-core CCX
Created 2012–2017
Transistors 14 nm (FinFET)
Socket(s)
Predecessor Excavator (4th gen)
Successor Zen+
Application Desktop, Laptop, Server, Workstation
Core name(s)
  • Raven Ridge (APUs)
    Summit Ridge (desktop CPUs)
    Zeppelin (server APUs)
    Naples (server CPUs)
Brand name(s)

Zen is the codename for a computer processor microarchitecture from AMD, and was first used with their Ryzen series of CPUs in February 2017. The first Zen based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen based CPUs codenamed "Summit Ridge" reached the market in early March 2017, with Zen-derived Opteron server processors expected in the second quarter of 2017, and Zen-based APUs expected to follow in the second half of 2017.

Zen is a clean sheet design that differs from the long-standing Bulldozer architecture. Zen-based processors use a 14 nm FinFET process, are reportedly more energy efficient, and have a significantly higher IPC. SMT has been introduced, allowing each core to run 2 threads. The cache system has also been redesigned, making the L1 cache write-back. Additionally, Zen based processors utilize the AM4 socket, bringing DDR4 support.

Zen is based on a SoC design. The memory, PCIe, SATA, and USB controllers are incorporated into the same chip as the processor cores. This has advantages in bandwidth and power, at the expense of chip complexity and die area. This SoC design will allow the Zen microarchitecture to scale from laptops and small-form factor mini PCs to high-end desktops and servers.

According to AMD, the main focus of Zen is on increasing per-core performance. New or improved features include:

The Zen architecture is built on a 14 nanometer FinFET process subcontracted to GlobalFoundries, giving greater efficiency than the 32 nm and 28 nm processes of previous AMD FX CPUs and AMD APUs, respectively. The "Summit Ridge" Zen family of CPUs use the AM4 socket and feature DDR4 support and a 95 W TDP (thermal design power). While newer roadmaps don't confirm the TDP for desktop products, they suggest a range for low-power mobile products with up to two Zen cores from 5 to 15 W and 15 to 35 W for performance-oriented mobile products with up to four Zen cores.


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