IBM z13 (microprocessor)
| Produced | 2015 |
|---|---|
| Designed by | IBM |
| Common manufacturer(s) | |
| Max. CPU clock rate | 5 GHz |
| Min. feature size | 22 nm |
| Instruction set | z/Architecture |
| Cores | 8 |
| L1 cache | 96 KB I-L1 128 KB D-L1 per core |
| L2 cache | 2 MB I-L2 2 MB D-L2 per core |
| L3 cache | 64 MB shared |
| Predecessor | zEC12 |
The z13 is a microprocessor made by IBM for their z13 mainframe computers, announced on January 14, 2015. Manufactured at GlobalFoundries' East Fishkill, New York fabrication plant (formerly IBM's own plant). IBM stated that it is the world's fastest microprocessor and is about 10% faster than its predecessor the zEC12 in general single-threaded computing, but significantly more when doing specialized tasks.
The Processor Unit chip (PU chip) has an area of 678 mm2 and contains 3.99 billion transistors. It is fabricated using IBM's 22 nm CMOS silicon on insulator fabrication process, using 17 metal layers and supporting speeds of 5.0 GHz, which is less than its predecessor, the zEC12. The PU chip can have six, seven or eight cores (or "processor units" in IBM's parlance) enabled depending on configuration. The PU chip is packaged in a single-chip module, a departure from IBM's previous mainframe processors, which were mounted on large multi-chip modules. A computer drawer consists of six PU chips and two Storage Controller (SC) chips.
The cores implement the CISC z/Architecture with a superscalar, out-of-order pipeline. It has facilities related to transactional memory, and new features such as two-way simultaneous multithreading (SMT), 139 new SIMD instructions, data compression, improved cryptography and logical partitioning. The cores have numerous other enhancements such as a new superscalar pipeline, on-chip cache design and error correction.
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