Names | |
---|---|
IUPAC name
Hexachlorodisilane
|
|
Other names
Disilicon hexachloride
|
|
Identifiers | |
3D model (Jmol)
|
|
ChemSpider | |
ECHA InfoCard | 100.033.353 |
EC Number | 236-704-1 |
PubChem CID
|
|
|
|
|
|
Properties | |
Si2Cl6 | |
Molar mass | 268.88 g/mol |
Appearance | Colorless liquid |
Melting point | −1 °C (30 °F; 272 K) |
Boiling point | 144 °C (291 °F; 417 K) |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
|
|
Infobox references | |
Hexachlorodisilane is the inorganic compound with the chemical formula Si2Cl6, It is a colourless liquid that fumes in moist air. It has specialty applications in as a reagent and as a volatile precursor to silicon metal.
The molecule adopts a structure like ethane, with a single Si-Si bond of length 0.233 nm.
Hexachlorodisilane is produced in the chlorination of silicides such as e.g. calcium silicide. Idealized syntheses are as follows:
Hexachlorodisilane is stable under air or nitrogen at temperatures of at least up to 400°C for several hours, but decomposes to dodekachloroneopentasilane and silicon tetrachloride in presence of Lewis bases even at room temperature.
This conversion is useful in making silicon-based components of use in semiconducting devices including photovoltaic cells.
The compound is also useful reagent for the deoxygenation reactions, such as this general process involving a phosphine oxide: