Names | |
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Preferred IUPAC name
Gallium arsenide
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Identifiers | |
1303-00-0 | |
3D model (Jmol) | Interactive image |
ChemSpider | 14087 |
ECHA InfoCard | 100.013.741 |
EC Number | 215-114-8 |
MeSH | gallium+arsenide |
PubChem | 14770 |
RTECS number | LW8800000 |
UN number | 1557 |
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Properties | |
GaAs | |
Molar mass | 144.645 g/mol |
Appearance | Very dark red, vitreous crystals |
Odor | garlic-like when moistened |
Density | 5.3176 g/cm3 |
Melting point | 1,238 °C (2,260 °F; 1,511 K) |
insoluble | |
Solubility | soluble in HCL insoluble in ethanol, methanol, acetone |
Band gap | 1.424 eV (at 300 K) |
Electron mobility | 8500 cm2/(V·s) (at 300 K) |
Thermal conductivity | 0.55 W/(cm·K) (at 300 K) |
Refractive index (nD)
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3.8 |
Structure | |
Zinc blende | |
T2d-F-43m | |
a = 565.35 pm
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Tetrahedral | |
Linear | |
Hazards | |
Safety data sheet | External MSDS |
GHS pictograms | |
GHS signal word | DANGER |
H301, H331, H410 | |
P261, P273, P301+310, P311, P501 | |
EU classification (DSD)
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T N |
R-phrases | R23/25, R50/53 |
S-phrases | (S1/2), S20/21, S28, S45, S60, S61 |
NFPA 704 | |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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what is ?) | (|
Infobox references | |
Gallium arsenide (GaAs) is a compound of the elements gallium and arsenic. It is a III-V direct bandgap semiconductor with a zinc blende crystal structure.
Gallium arsenide is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows.
GaAs is often used as a substrate material for the epitaxial growth of other III-V semiconductors including indium gallium arsenide, aluminum gallium arsenide and others.
In the compound, gallium has a +3 oxidation state. Gallium arsenide single crystals can be prepared by three industrial processes:
Alternative methods for producing films of GaAs include:
Oxidation of GaAs occurs in air and degrades performance of the semiconductor. The surface can be passivated by depositing a cubic gallium(II) sulfide layer using a tert-butyl gallium sulfide compound such as (t
BuGaS)
7.