Apple A11
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| Produced | From September 12, 2017 to present |
|---|---|
| Designed by | Apple Inc. |
| Common manufacturer(s) | |
| Max. CPU clock rate | to 2.39 GHz |
| Min. feature size | 10 nm |
| Instruction set | A64 |
| Microarchitecture | ARMv8‑A compatible |
| Product code | APL1W72 |
| Cores | Hexa-core (2× Monsoon + 4× Mistral) |
| L1 cache | 32 KB instruction, 32 KB data |
| L2 cache | 8 MB |
| L3 cache | none |
| Predecessor | Apple A10 Fusion |
| GPU | Apple-designed 3 core |
| Application | Mobile |
The Apple A11 Bionic is a 64-bit ARM-based system on a chip (SoC), designed by Apple Inc. and manufactured by TSMC. It first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X which were introduced on September 12, 2017. It has two high-performance cores which are 25% faster than the Apple A10 and four high-efficiency cores which are up to 70% faster than the energy-efficient cores in the A10.
The A11 features an Apple-designed 64-bit ARMv8-A six-core CPU, with two high-performance cores at 2.39 GHz, called Monsoon, and four energy-efficient cores, called Mistral. The A11 uses a new second-generation performance controller, which permits the A11 to use all six cores simultaneously, unlike its predecessor the A10. The A11 also integrates an Apple-designed three-core graphics processing unit (GPU) with 30% faster graphics performance than the A10. Embedded in the A11 is the M11 motion coprocessor. The A11 includes a new image processor which supports computational photography functions such as lighting estimation, wide color capture, and advanced pixel processing.
The A11 is manufactured by TSMC using a 10 nm FinFET process and contains 4.3 billion transistors on a die 87.66 mm2 in size, 30% smaller than the A10. It is manufactured in a package on package (PoP) together with 2 GB of LPDDR4X memory in the iPhone 8 and 3 GB of LPDDR4X memory in the iPhone 8 Plus and iPhone X.
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