Surface-mount

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

By employing SMT, the production process speeds up, but the risk of defects also increase due to the components miniaturization and denser packing of boards. In those conditions, the failures detection have become critical for any SMT manufacturing process.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

Surface mounting was originally called "planar mounting".

Surface-mount technology was developed in the 1960s and became widely used in the late 1980s. Much of the pioneering work in this technology was by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the Launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities. Often only the solder joints hold the parts to the board, in rare cases parts on the bottom or "second" side of the board may be secured with a dot of adhesive to keep components from dropping off inside reflow ovens if the part has a large size or weight. Adhesive is sometimes used to hold SMT components on the bottom side of a board if a wave soldering process is used to solder both SMT and through-hole components simultaneously. Alternatively, SMT and through-hole components can be soldered together without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding the parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of equivalent through-hole parts.

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