Physical vapour deposition

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. Examples include semiconductor devices such as thin film solar panels, aluminized PET film for food packaging and balloons, and coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools (mainly for scientific purposes) have been developed.

Common industrial coatings applied by PVD are titanium nitride, zirconium nitride, chromium nitride, titanium aluminum nitride.

The source material is unavoidably also deposited on most other surfaces interior to the vacuum chamber, including the fixturing used to hold the parts.

Various thin film characterisation techniques can be used to measure the physical properties of PVD coatings, such as:

As mentioned previously, PVD coatings are generally used to improve hardness, wear resistance and oxidation resistance. Thus, such coatings are used in a wide range of applications such as:

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