Public | |
Traded as | NASDAQ: OVTI |
Industry | Semiconductors |
Founded | 1990 |
Founder | Shaw Hong Raymond Wu |
Headquarters | Santa Clara, California, U.S. |
Area served
|
Worldwide |
Key people
|
Shaw Hong (CEO and President) Anson Chan (CFO) |
Products | Image sensor technologies |
Revenue | $1.379B |
Number of employees
|
2200 (2015) |
Website | www.ovt.com |
OmniVision Technologies Inc. is a corporation that designs and develops advanced digital imaging technologies and products for use in mobile phones, notebooks, netbooks and webcams, security and surveillance cameras, entertainment, digital still and video cameras, automotive and medical imaging systems. Headquartered in Santa Clara, California, OmniVision Technologies has offices in the USA, Western Europe and Asia, including a design center and testing facility in Shanghai, China.
OmniVision was founded in 1995 by Shaw Hong and Raymond Wu.
Some company milestones:
OmniVision’s front-side illumination (FSI) technology architecture enhances image capture under very low lighting conditions. It is used to manufacture compact cameras in mobile handsets, notebook computers and other applications that require low-light performance without the need for flash.
OmniPixel3-HS is the technology behind its image sensor module that will, for example, be used by Dahua, a video surveillances provider, to produce cloud-based cameras for smart home systems.
Backside illuminated image (BSI) technology differs from FSI architectures in how light is delivered to the photosensitive area of the sensor. In FSI architectures, the light must first pass through transistors, dieletric layers, and metal circuitry. In contrast, OmniBSI technology turns the image sensor upside down and applies color filters and micro lenses to the backside of the pixels, resulting in light collection through the backside of the sensor. This puts the metal and dielectric layers below the sensor array, providing the most direct path for light to travel into the pixel, which optimizes image quality.
The second-generation BSI technology, developed in cooperation with Taiwan Semiconductor Manufacturing Company Limited (TSMC), is built using custom 65 nm design rules and 300mm copper processes. This combination supports improved low-light sensitivity, dark current, and full-well capacity over the first-generation of BSI technology, as well as sharper image quality.