IBM 3081
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| Manufacturer | International Business Machines Corporation (IBM) |
|---|---|
| Product family | IBM 3081 IBM 3083 IBM 3084 |
| Release date | 1980 for the 3081; 1982 for the 3083 & 3084 |
| Discontinued | August 4, 1987 (all 308X) |
The IBM 308X was a line of mainframe computers, the first model of which, the Model 3081 Processor Complex, was introduced November 12, 1980. It consisted of a 3081 Processor Unit with supporting units.
Later models in the series were the 3083 and the 3084. The 3083 was announced March 31 and the 3084 on September 3, both in 1982.
The IBM 308X line introduced the System/370 Extended Architecture.
All three 308X systems, which IBM had marketed as "System/370-Compatibles," were withdrawn August 4, 1987.
The initial 3081 offered, the 3081D, was a 5 MIP machine. The next offering, the 3081K, was a 7 MIP machine. Last came the 3081G.
The 3081D was announced Nov 12, 1980; the 3081K came nearly a year later; the 3081G was introduced September 3, 1982 as part of the initial 3084 announcement.
"The IBM 3081 Processor Complex offers flexible growth steps in the 308X family of processors, between the 3083 Model Groups F, B and J and the 3084."
The 3081 was "two processors in a single box ... it was not possible to partition it and run it as two independent machines."
The dyadic concept offers "under the cover" dual processors.
Some key technological features of the 3081, compared to the previous most powerful processor, the 3033, were the following:
Both central processors have access to channels (as many as 24), and main memory (up to 32 megabytes).
The elimination of a layer of packaging was achieved through the development of the Thermal Conduction Module (TCM), a flat ceramic module containing about 30,000 logic circuits on up to 118 chips. The TTL chips (which were not compatible with the TTL chips sold on the open market by many manufacturers) were joined face-down (sometimes called "flip chip") to the TCM with an array of 11 × 11 solder pads. The TCM contains 33 metalized layers which distribute signals and power. "A module is connected to the next level of packaging through 1800 pins (1200 are available for signals, 500 pins are available for power, and 100 pins are spare)." (p. 7) The module is fitted with a helium-filled metal cap, which contains one piston per chip; the piston presses against the back of each chip to provide a heat conduction path from the chip to the cap. A water-cooled cold plate is attached to the cap; the water temperature is approximately 24 °C. This arrangement provides cooling of the module heat flux on the order of 105 watts per square meter, which is about a tenfold increase over the 3033 processor.
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