Hot-carrier injection

Hot carrier injection (HCI) is a phenomenon in solid-state electronic devices where an electron or a “hole” gains sufficient kinetic energy to overcome a potential barrier necessary to break an interface state. The term "hot" refers to the effective temperature used to model carrier density, not to the overall temperature of the device. Since the charge carriers can become trapped in the gate dielectric of a MOS transistor, the switching characteristics of the transistor can be permanently changed. Hot-carrier injection is one of the mechanisms that adversely affects the reliability of semiconductors of solid-state devices.

The term “hot carrier injection” usually refers to the effect in MOSFETs, where a carrier is injected from the conducting channel in the silicon substrate to the gate dielectric, which usually is made of silicon dioxide (SiO₂).

To become “hot” and enter the conduction band of SiO₂, an electron must gain a kinetic energy of ~3.2 eV. For holes, the valence band offset in this case dictates they must have a kinetic energy of 4.6 eV. The term "hot electron" comes from the effective temperature term used when modelling carrier density (i.e., with a Fermi-Dirac function) and does not refer to the bulk temperature of the semiconductor (which can be physically cold, although the warmer it is, the higher the population of hot electrons it will contain all else being equal).

The term “hot electron” was originally introduced to describe non-equilibrium electrons (or holes) in semiconductors. More broadly, the term describes electron distributions describable by the Fermi function, but with an elevated effective temperature. This greater energy affects the mobility of charge carriers and as a consequence affects how they travel through a semiconductor device.

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