ASE Group
| Public | |
| Traded as | NYSE: ASX |
| Industry | Semiconductor assembly, testing & packaging |
| Founded | 1984 |
| Founders |
Jason Chang Richard Chang |
| Headquarters | Kaohsiung, Taiwan |
|
Area served
|
Worldwide |
| Revenue | USD $8.72 billion (2015) |
|
Number of employees
|
65,695 |
| Website | www |
Advanced Semiconductor Engineering, Inc.(日月光半導體製造股份有限公司), also known as ASE Group(日月光集團), is a Taiwan-based provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.
The company was founded in 1984 by brothers Jason Chang and Richard Chang, who opened its first factory in Kaohsiung, Taiwan. Jason Chang currently serves as company chairman and is on the 2016 Forbes’ list of the world’s billionaires.
As of April 1, 2016, the company's market cap was USD 8.77 billion.
In May 2015, ASE Group entered into an agreement with TDK to establish a joint venture company in Kaohsiung, Taiwan, named ASE Embedded Electronics Inc. The company manufactures IC embedded substrates utilizing TDK’s SESUB technology.
On May 26, 2016, ASE and Siliconware Precision Industries (SPIL) announced that they signed an agreement to form a new holding company, as part of the consolidation in the global semiconductor industry. Both companies said that each will retain its legal entities, management and staff, besides the current independent operations and operating models.
According to the market research firm Gartner, ASE is the largest Outsourced Semiconductor Assembly and Test (OSAT) provider, with 19 percent market share. The company offers services such as semiconductor assembly, packaging and testing. ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world. The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system in package (SiP) and copper wire bonding.
Fan-out wafer-level packaging (FO-WLP), a process that enables ultra-thin, high-density packages, has been around for several years, and the fan-out technology is becoming an industry trend due to increasing market demand for smaller and thinner mobile products. According to the research firm Yole Développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014.
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